International Journal of Electro-Mechanics and Material Behavior

International Journal of Electro-Mechanics and Material Behavior is a peer-reviewed hybrid open access journal launched in 2015 and focused on electromechanical modeling and Micro-electromechanical systems. This journal aims to promote advances in electrical machines and instruments, research in Kinematics and dynamic analysis, wear and degradation of the material, mechanical behavior of materials, fluid dynamics, and sophisticated motion control. With this in mind, the journal anticipates that all contributions would offer substantial results and will have a lasting effect on the field of research. Journal seeks work that presents innovation and promises future research.

Title	International Journal of Electro-Mechanics and Material Behavior
Journal Abbreviation	IJEMB
Issues Per Year (Frequency)	2 issues
CODEN	IJOEMAMB
Publisher	STM Journals, An imprint of Consortium e-Learning Network Pvt. Ltd.
DOI	10.37591/IJEMB
Copyright	STM Journals, An imprint of Consortium e-Learning Network Pvt. Ltd.
Starting Year	2023
subject	Applied Mechanics
Language	English
Publication Format	Hybrid, and Open Access
Type of Publication	Peer-reviewed Journal (Refereed Journal)
Website	https://stmjournals.in
Address	STM Journals, An imprint of Consortium e-Learning Network Pvt. Ltd. A-118, 1st Floor, Sector-63, Noida, U.P. India, Pin - 201301
Indexing	Google Scholar

Refreed Journal

Focus and Scope:

Electromechanical modeling: energy harvesting, Galerkin method, vibrations, Actuators, Torque, Magnetic analysis, Electromagnetic analysis, Analytical models, Manufacturing, Induction motors, Design engineering, Stators, Robots.

Micro-electromechanical systems: Atomic layer deposition (ALD), Alumina, MEMS, Micromachining, Reliability, Etching, Patterning, atomic layer deposition (ALD)Alumina.switches, piezoelectric devices, and Relay: Relays, Switches, III-V semiconductor materials, Actuators, Nanoelectromechanical systems, Stress, Logic gates, Switches, Relays, Residual stresses, III-V semiconductor materials, Films, Nanoelectromechanical systems.Microcontroller circuit: Automated single-ring infiltrometer, Arduino, BEST (Beerkan Estimation of Soil Transfer parameters), Hydraulic properties, Amplitude-adjustable, four-wing attractor, chaotic circuit, microcontroller-based RNG.

Electronics Engineering, Electrical Engineering: Finite element methods, Magnetostatics, Eddy currents, Radiofrequency, Finite difference methods, Difference equations, Scattering, Solid modeling, Computer-aided engineering, Partial differential equations.Mechanical/Magnetic behavior and testing of metals: Austenite, Structural steel, Non-magnetic, Permeability, Toughness, Fracture toughness, Microstructure, Electrical machines, Powder metallurgy, Soft magnetic composites, Magnetic properties.Structure of materials.- Elasticity, Plasticity, and failure: Solitary Wave, Process Zone, Collective Mode Shock Wave Front, Crack, Velocity, Orthotropy, Elasto-plasticity, FEM, Wood, Brittle failure, User-subroutine, ABAQUS.

Mechanical behavior of metals, ceramics, polymers, fibers, and composite, Design and fabrication of materials: Composite–polymer matrix, Filaments, Mechanical properties, Additive Manufacturing, Composite, Fused Deposition Modeling, Mechanical property.Sophisticated motion control and hand-held electronic/photographic devices: Digital Imaging, Electronic Displays, Digital Photography, Electronic Imaging, Control systems, Position control, Process control.

Keywords:

Electrical Engineering

Microcontroller circuit

Piezoelectric devices

Electromechanical modeling

Indexing

Submission of Paper:

All contributions to the journal are rigorously refereed and are selected on the basis of quality and originality of the work. The journal publishes the most significant new research papers or any other original contribution in the form of reviews and reports on new concepts in all areas pertaining to its scope and research being done in the world, thus ensuring its scientific priority and significance.

Manuscripts are invited from academicians, students, research scholars and faculties for publication consideration. Papers are accepted for editorial consideration through mail [email protected].

Plagiarism: All the articles will be check through Plagiarism Software before publication.

Subject: Applied Mechanics

Abbreviation: IJEMB

Peer Reviewed Policy

Editorial Board

Instructions to Authors